Oxford Semiconductor Introduces First Single-Chip PCIe Multi-Port Connectivity Solution
Delivers High Performance PCIe Bridging With Up To 40 Percent Cost Savings And Up To Six Months Reduction In Development Time
MILPITAS, Calif. -- November 18, 2008 -- Addressing the transition in PCs/Servers and PC/Server chipsets from PCI to PCI Express (PCIe) as the main system bus, Oxford Semiconductor today introduced the OXPCIe200 PCI Express Multi-Port Bridge. The OXPCIe200 represents the industry's first multi-port device to offer designers a range of options for PCI Express bridging that can be used together or in isolation to connect subsystems to a PCIe-based system.
Targeting the bridging, device control and IO expansion needs of industrial control, PC peripherals, ExpressCard™ modules, point-of-sale terminals, servers, communications systems and embedded designs, the OXPCIe200 provides the bridging power required for inter-processor communication and device control in these PCIe-based systems. A three port device, it has a unique connectivity set comprised of a USB 2.0 host port, a port configurable as a USB 2.0 host, SPI or SRAM interface and a UART port.
The single-chip device has been designed to achieve the high level system performance required by demanding bridging applications, while at the same time offering fast, easy design-in. As the first single-chip PCIe end-point to USB 2.0 Host, SPI and SRAM solution, this highly integrated device delivers up to 62.5 Mbytes/s data throughput and low CPU utilization at a 30 to 40 percent cost saving, while also saving designers from three to six months of development time.
"Oxford identified system designers' critical requirements for high performance, easy to design-in, PCI Express bridging solutions that work to reduce development time and accelerate time to market," said Adrian Braine, Marketing Director of Connectivity Solutions, Oxford Semiconductor. "The OXPCIe200 is a completely unique product to the industry, and delivers numerous benefits while maintaining Oxford's reputation for quality products and a leadership position within the industry for PCI Express-related connectivity solutions."
A performance optimized, flexible and easy to design bridging solution, the OXPCIe200 delivers a choice of intermediate bridging formats that make it ideal for a diverse range of applications and with support for multiple data pipes, multi-channel DMA and MSI-X interrupts, delivering truly outstanding system performance. The addition of active state power management (ASPM), a completely digital (Phy-less) interface using a unique reverse ULPI port, PCI power management (including wake up from D3cold) and industrial temperature range as a standard feature, make the OXPCIe200 ideal for power and temperature sensitive ExpressCard™ and miniCard™ designs.
Samples of the OXPCIe200-TAAG are available now, priced at $5.56 for quantities of 10,000 or above. An evaluation kit, part number EK-OXPCIe200, with Oxford's Oxide™ suite of development tools is available from stock at $249.00. For more information please visit http://www.oxsemi.com or contact your local representative.
About Oxford Semiconductor
Whether transferring data from a consumer product to a storage device or backing-up and protecting data, Oxford Semiconductor is at the very heart of secure, reliable, robust storage systems for today's connected digital lifestyle. Established in 1992, the company provides a broad range of semiconductor hardware and software solutions that enable seamless device-to-device interconnectivity. Headquartered in Silicon Valley, California, the company has design centers in Abingdon, UK and Singapore, as well as sales support offices worldwide. For more information visit www.oxsemi.com.